ISSN : 2288-1484(Online)
DOI : https://doi.org/10.12812/ksms.2013.15.1.109
가속수명시험을 이용한 Packaging Substrate PCB의 ECM에 대한 신뢰성 예측에 관한 연구
A Study on the Reliability Prediction about ECM of Packaging Substrate PCB by Using Accelerated Life Test
Abstract
In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, 20/20㎛ patternwidth/space applied by Semi Additive Process, was performed, and through this test, the investigation of failuremechanism and the life-time prediction evaluation under actual user environment was implemented. The resultof accelerated test has been compared and estimated with life distribution and life stress relatively by usingMinitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life hasbeen estimated under 95% confidence level of failure data happened in each test conditions. And the life inactual usage environment has been predicted by using generalized Eyring model considering temperature andhumidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have beencalculated.
- 12 이화기 109-120.pdf724.1KB
Reference
2.IPC(1997), "IPC-TM-650 Test Methods Manual", the Institude for Interconnecting and Packaging Electronic Circuit.
3.Dong-Kyu Jang and Myong-Yu Choi (2009), "Printed Circuit Board", Sung-an-dang.
4.M.B. Bever(1987), "M.G. Fontana Corrosion Engineering, 3rd ed.", McGraw-Hill, NewYork, 41.
5.Won-Sik Hong(2005), "Study on the Metallic Ion Migration Phenomena of PCB", Korean journal of Material Research, 15(1):35-40.
6.Shin-Bok Lee(2005), "Influence of Polaization Behaviors on the ECM Characteristics of Sn Pb Solder Alloys in PCB" Journal of the Micro-electronics & Packaging Society, 12(2):167-174.
7.Hirokazu(2012), "Introduction of Reliability Test Technology for Electronics Package", Journal of the Microelectronics & Packaging Society,.19(1):1-7.
8.Ja-Young Chung(2007), "The Study on the Correlation of Polaization Behaviors on the Electrochemical Migration Characteristics of Sn Pb Solder Alloys ", M.S. Thesis, Andong University.
9.Yi-Jang Kyun(1997), "Development of Effective Reliability Experiment Method on PCB by Quality Function Development Process", Ph.D. Dissertation, Hongik University.
10.KATS(2006), "KS A 5608-1 ALT - Introduction to Accelerated Life Testing", Korean Agency for Technology and Standards.
11.KATS(2006), "KS A 5608-1 ALT - Design of Accelerated Life Testing", Korean Agency for Technology and Standards.
12.KATS(2006), "KS A 5608-1 ALT - Data Analysis of Accelerated Life Testing", Korean Agency for Technology and Standards.
13.Young-Rock Chun and Do-Sun Bae(1999), "Reliability Analysis", Arkye.
14.Minitab(2000), "Data Analysis and Quality Tools", Minitab.
-
-
Online Submission
http://submission.koreasafety.or.kr
-
KSSM
The Korean Society of Safety ManagementWaste Society
-
Editorial Office
Contact Information- Tel: +82.31.336.2844
- Fax: +82.31.336.2845
- E-mail: safety@mju.ac.kr