ISSN : 1229-6783(Print)
ISSN : 2288-1484(Online)
ISSN : 2288-1484(Online)
Journal of the Korea Safety Management & Science Vol.15 No.1 pp.109-120
DOI : https://doi.org/10.12812/ksms.2013.15.1.109
DOI : https://doi.org/10.12812/ksms.2013.15.1.109
가속수명시험을 이용한 Packaging Substrate PCB의 ECM에 대한 신뢰성 예측에 관한 연구
A Study on the Reliability Prediction about ECM of Packaging Substrate PCB by Using Accelerated Life Test
Received January 8, 2013; Revision Received March 5, 2013; Accepted March 8, 2013.
Abstract
As information-oriented industry has been developed and electronic devices has come to be smaller, lighter,multifunctional, and high speed, the components used to the devices need to be much high density and shouldhave find pattern due to high integration. Also, diverse reliability problems happen as user environment isgetting harsher. For this reasons, establishing and securing products and components reliability comes to keyfactor in company’s competitiveness. It makes accelerated test important to check product reliability in fastway. Out of fine pattern failure modes, failure of Electrochemical Migration(ECM) is kind of degradation ofinsulation resistance by electro-chemical reaction, which it comes to be accelerated by biased voltage in hightemperature and high humidity environment.
In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, 20/20㎛ patternwidth/space applied by Semi Additive Process, was performed, and through this test, the investigation of failuremechanism and the life-time prediction evaluation under actual user environment was implemented. The resultof accelerated test has been compared and estimated with life distribution and life stress relatively by usingMinitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life hasbeen estimated under 95% confidence level of failure data happened in each test conditions. And the life inactual usage environment has been predicted by using generalized Eyring model considering temperature andhumidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have beencalculated.
In this thesis, the accelerated life test for failure caused by ECM on fine pattern substrate, 20/20㎛ patternwidth/space applied by Semi Additive Process, was performed, and through this test, the investigation of failuremechanism and the life-time prediction evaluation under actual user environment was implemented. The resultof accelerated test has been compared and estimated with life distribution and life stress relatively by usingMinitab software and its acceleration rate was also tested. Through estimated weibull distribution, B10 life hasbeen estimated under 95% confidence level of failure data happened in each test conditions. And the life inactual usage environment has been predicted by using generalized Eyring model considering temperature andhumidity by developing Arrhenius reaction rate theory, and acceleration factors by test conditions have beencalculated.
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Reference
1.IPC(1997), "IPC-TR-476A Electrochemical Migration", the Institude for Interconnecting and Packaging Electronic Circuit.
2.IPC(1997), "IPC-TM-650 Test Methods Manual", the Institude for Interconnecting and Packaging Electronic Circuit.
3.Dong-Kyu Jang and Myong-Yu Choi (2009), "Printed Circuit Board", Sung-an-dang.
4.M.B. Bever(1987), "M.G. Fontana Corrosion Engineering, 3rd ed.", McGraw-Hill, NewYork, 41.
5.Won-Sik Hong(2005), "Study on the Metallic Ion Migration Phenomena of PCB", Korean journal of Material Research, 15(1):35-40.
6.Shin-Bok Lee(2005), "Influence of Polaization Behaviors on the ECM Characteristics of Sn Pb Solder Alloys in PCB" Journal of the Micro-electronics & Packaging Society, 12(2):167-174.
7.Hirokazu(2012), "Introduction of Reliability Test Technology for Electronics Package", Journal of the Microelectronics & Packaging Society,.19(1):1-7.
8.Ja-Young Chung(2007), "The Study on the Correlation of Polaization Behaviors on the Electrochemical Migration Characteristics of Sn Pb Solder Alloys ", M.S. Thesis, Andong University.
9.Yi-Jang Kyun(1997), "Development of Effective Reliability Experiment Method on PCB by Quality Function Development Process", Ph.D. Dissertation, Hongik University.
10.KATS(2006), "KS A 5608-1 ALT - Introduction to Accelerated Life Testing", Korean Agency for Technology and Standards.
11.KATS(2006), "KS A 5608-1 ALT - Design of Accelerated Life Testing", Korean Agency for Technology and Standards.
12.KATS(2006), "KS A 5608-1 ALT - Data Analysis of Accelerated Life Testing", Korean Agency for Technology and Standards.
13.Young-Rock Chun and Do-Sun Bae(1999), "Reliability Analysis", Arkye.
14.Minitab(2000), "Data Analysis and Quality Tools", Minitab.
2.IPC(1997), "IPC-TM-650 Test Methods Manual", the Institude for Interconnecting and Packaging Electronic Circuit.
3.Dong-Kyu Jang and Myong-Yu Choi (2009), "Printed Circuit Board", Sung-an-dang.
4.M.B. Bever(1987), "M.G. Fontana Corrosion Engineering, 3rd ed.", McGraw-Hill, NewYork, 41.
5.Won-Sik Hong(2005), "Study on the Metallic Ion Migration Phenomena of PCB", Korean journal of Material Research, 15(1):35-40.
6.Shin-Bok Lee(2005), "Influence of Polaization Behaviors on the ECM Characteristics of Sn Pb Solder Alloys in PCB" Journal of the Micro-electronics & Packaging Society, 12(2):167-174.
7.Hirokazu(2012), "Introduction of Reliability Test Technology for Electronics Package", Journal of the Microelectronics & Packaging Society,.19(1):1-7.
8.Ja-Young Chung(2007), "The Study on the Correlation of Polaization Behaviors on the Electrochemical Migration Characteristics of Sn Pb Solder Alloys ", M.S. Thesis, Andong University.
9.Yi-Jang Kyun(1997), "Development of Effective Reliability Experiment Method on PCB by Quality Function Development Process", Ph.D. Dissertation, Hongik University.
10.KATS(2006), "KS A 5608-1 ALT - Introduction to Accelerated Life Testing", Korean Agency for Technology and Standards.
11.KATS(2006), "KS A 5608-1 ALT - Design of Accelerated Life Testing", Korean Agency for Technology and Standards.
12.KATS(2006), "KS A 5608-1 ALT - Data Analysis of Accelerated Life Testing", Korean Agency for Technology and Standards.
13.Young-Rock Chun and Do-Sun Bae(1999), "Reliability Analysis", Arkye.
14.Minitab(2000), "Data Analysis and Quality Tools", Minitab.
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