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ISSN : 1229-6783(Print)
ISSN : 2288-1484(Online)
Journal of the Korea Safety Management & Science Vol.15 No.2 pp.129-134
DOI : https://doi.org/10.12812/ksms.2013.15.2.129

PCB회로 보드장치내의 안정적 방열설계를 위한 연구

원 종 운*, 이 종 휘**
*서남대학교 전자전기공학과, **군산대학교 기계공학부

The stable design of radiant heat inside PCB circuit board device

Jong-Hwi Lee**, Jong-Wun Won*
**Dept. of Mechanical Engineering, Kunsan National University
*Dept. of electronic warfare aircraft Engineering, Seonam University
Received April 20, 2013; Revision Received June 11, 2013; Accepted June 18, 2013.

Abstract

　In this study, the heat flow analysis compatible commercial code CFX 11 was used to develop the structureinside PCB circuit board devices, which could stable radiant heat as well as the cooling device within it. Incase of modifying the arrangement of electronic parts on the PCB inside the multi channel temperaturemeasurement board devices, radiant heat effects did not show a rising tendency, whereas the overalltemperature went down in case of installing the vents in the outer case of PCB circuit board devices. In termsof installation location, it was the most appropriate to install it on the electronic parts with no heat. Besides, incase of mounting the fan as a cooling device by considering various user environments for multi channeltemperature measurement board devices, the radiant heat effects were shown higher than in case of installingthe vents, and the middle sections were the most appropriate to its installation location. In case of changingthe wind quantity of the fan from its selected installation location, the best radiant heat effects were shown athigh speed as expected.
CFX 11,PCB Circuit Board,Radiant heat
16 원종운(129-134).pdf1.06MB

Reference

1.S,H, Park, M,C, Choi, "Experimental Study on Thermal Performance of Piezoelectric Fan in an Encolsure", Journal of mechanical science and technology, B, vol 30, No12, pp.1173-1180, 2006
2.Y,S, Son, J,Y, Shin, "Numerical Analysis on Cooling Characteristics of Electronic Components Using Convection and Conduction Heat Transfer", Journal of mechanical science and technology, D, pp.390-395, 2001
3.H,Y, Pak, K,W, Park, "A Numerical Study on the Effect of PCB Structure Variation on the Electronic Equipment Cooling", Journal of mechanical science and technology, vol19, No12, pp.3329-3343, 1995
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